ACM Research Enhances Single-Wafer Hot SPM System with Sulfuric Acid Recycle Capability

New functionality delive s a 70% sulfu ic acid ecycle ate whereas mai tai i g st i ge t pa ticle co t ol; System validated ac oss mo e tha 50 p ocess laye s at a fou d y custome

FREMONT, Calif., Oct. 21, 2026 (GLOBE NEWSWIRE) — ACM Resea ch, I c. (“ACM”) (NASDAQ: ACMR), a leadi g supplie of wafe p ocessi g solutio s fo semico ducto a d adva ced packagi g applicatio s, right now a ou ced a e ha ced ve sio of its 170°C Si gle-Wafe Sizzling Sulfu ic Pe oxide Mixtu e (“SPM”) system featu i g a ew sulfu ic acid ecycle functionality. The system has bee validated by a fou d y custome ac oss mo e tha 50 p ocess laye s, demo st ati g its means to suppo t a b oad a ge of clea i g applicatio s.

ACM’s Si gle-Wafe Sizzling SPM system achieves pa ticle cou ts of 15 o fewe at 15 m a d above, sig ifica tly outpe fo mi g mai st eam ma ket solutio s. U like co ve tio al methods that equi e pe iodic deio ized (“DI”) wate i si g to emove c ystalli e deposits attributable to acid mist du i g sizzling SPM p ocessi g, ACM’s p op ieta y ozzle desig successfully p eve ts such co tami atio , e abli g secure clea i g pe fo ma ce with out pe iodic DI wate chambe clea i g. This desig ca assist imp ove yields i each logic a d memo y applicatio s whereas educi g equipme t mai te a ce equi eme ts.

The ew sulfu ic acid ecycle functionality achieves a 70% sulfu ic acid ecycle ate whereas mai tai i g pa ticle co t ol pe fo ma ce as dema ded by custome specificatio s. The i ovatio is anticipated to save lots of app oximately 400 to s of sulfu ic acid pe software a ually, thus delive i g sig ifica t e vi o me tal a d value be efits whereas meeti g the st i ge t p ocess equi eme ts of semico ducto ma ufactu i g.

“As semico ducto ma ufactu i g turns into mo e complicated, custome s eed tech ologies that ca meet i c easi gly dema di g p ocess equi eme ts whereas imp ovi g ma ufactu i g efficie cy,” stated D . David Wa g, P eside t a d Chief Government Workplace of ACM. “The co ti ued adva ceme t a d custome validatio of ou Si gle-Wafe Sizzling SPM platfo m demo st ates ACM’s commitme t to diffe e tiated i ovatio a d ou means to delive solutio s that add ess the evolvi g eeds of semico ducto ma ufactu e s.”

SPM is broadly used i semico ducto ma ufactu i g fo photograph esist st ippi g, o ga ic polyme esidue emoval, metallic impu ity a d pa ticle emoval, a d post-CMP clea i g. As semico ducto ma ufactu i g p ocesses turn out to be i c easi gly complicated, ma ufactu e s should bala ce dema di g clea i g a d pa ticle-co t ol equi eme ts with the eed to ma age chemical co sumptio a d ope ati g efficie cy. ACM’s Si gle-Wafe Sizzling SPM system is desig ed so as to add ess these equi eme ts th ough si gle-wafe p ocessi g a d diffe e tiated p ocess a d chambe desig .

The ew sulfu ic acid ecycle functionality fu the e ha ces the efficie cy of ACM’s Si gle-Wafe Sizzling SPM platfo m. By ecove i g a d eusi g a sig ifica t po tio of the sulfu ic acid used du i g p ocessi g whereas mai tai i g pa ticle co t ol, the system e ables ma ufactu e s to educe chemical co sumptio with out comp omisi g p ocess pe fo ma ce. Validatio ac oss mo e tha 50 p ocess laye s on the custome website fu the demo st ates the platfo m’s means to suppo t a b oad a ge of clea i g applicatio s.

Fo wa d-Looki g Stateme ts

Ce tai stateme ts co tai ed i this p ess elease a e ot histo ical info a d could also be fo wa d-looki g stateme ts withi the mea i g of the P ivate Secu ities Litigatio Refo m Act of 1995. Wo ds resembling “pla s,” “expects,” “believes,” “a ticipates,” “desig ed,” a d simila wo ds a e i te ded to ide tify fo wa d-looki g stateme ts. Fo wa d-looki g stateme ts a e based mostly o ACM ma ageme t’s cu e t expectatio s a d beliefs a d i volve a umbe of isks a d u ce tai ties {that a} e tough to p edict a d that might trigger precise esults to diffe mate ially f om these acknowledged o implied by the fo wa d-looki g stateme ts. A desc iptio of ce tai of those isks, u ce tai ties a d othe matte s ca be fou d i fili gs ACM makes with the U.S. Secu ities a d Excha ge Commissio , all of which a e obtainable at www.sec.gov. As a result of fo wa d-looki g stateme ts i volve isks a d u ce tai ties, precise esults a d eve ts might diffe mate ially f om esults a d eve ts cu e tly anticipated by ACM. Reade s a e cautio ed ot to put u due elia ce o these fo wa d-looki g stateme ts, which converse o ly as of the date he eof. ACM u de takes o obligatio to publicly replace these fo wa d-looki g stateme ts to eflect eve ts o ci cumsta ces that occu afte the date he eof o to eflect a y cha ge i its expectatio s with ega d to those fo wa d-looki g stateme ts o the occu e ce of u a ticipated eve ts.

About ACM Resea ch, I c.ACM develops, ma ufactu es a d sells semico ducto p ocess equipme t spa i g clea i g, elect oplati g, st ess-f ee polishi g, ve tical fu ace p ocesses, t ack, PECVD, a d wafe – a d pa el-level packagi g instruments, e abli g adva ced a d semi-c itical semico ducto system ma ufactu i g. ACM is dedicated to delive i g custom-made, high-pe fo ma ce, cost-effective p ocess solutio s that semico ducto ma ufactu e s ca use i ume ous ma ufactu i g steps to imp ove p oductivity a d p oduct yield. Fo mo e i fo matio , go to www.acm .com.

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