DUJUD Has Developed TriChipLink Technology, Enabled by Printed System-in-Package and 3D Interconnection Technologies
ATLANTA, GA / ACCESSWIRE / January 9, 2025 / For the primary time, TriChipLink Know-how, developed by DUJUD, permits chip designers to combine a number of silicon microdevices right into a 3D digital microsystem. DUJUD’s proprietary manufacturing and 3D interconnection applied sciences function the elemental constructing blocks of TriChipLink. This modern know-how interconnects numerous microdevices, starting from micro-electro-mechanical-systems (MEMS) to microcontrollers and sensors, in a non-planar configuration.
“Over the previous 30 years, quite a few applied sciences have been developed to beat the constraints of constrained 2D silicon actual property. Whereas 3D microsystems promise the best density of integration, they face elementary challenges corresponding to manufacturability and reliability. TriChipLink addresses many of those long-standing points,” mentioned Dr. Reza Abbaspour, CEO of DUJUD.
In trendy system-in-package (SiP) microelectronics, typical strategies like wire bonding and flip-chip bonding for off-chip interconnections undergo from vital drawbacks. Wire bonds exhibit giant electrical parasitics, whereas flip-chip-bonded solder bumps are susceptible to mechanical failures, notably in heat-dissipating microchips. TriChipLink eliminates these points by introducing a novel interconnection know-how primarily based on superior 3D microstructures.
“Wire bonds are infamous for poor high-frequency efficiency because of their inductive parasitics, which outcome from their prolonged bodily lengths. In the meantime, flip-chip-bonded solder bumps are extremely unreliable in warmth dissipating microchips. Our proprietary 3D interconnection know-how, a key part of TriChipLink, resolves each points,” mentioned Dr. Abbaspour.
The 3D digital microstructures employed in TriChipLink function considerably shorter electrical lengths, decreasing electrical losses by at the very least 30%. Moreover, these 3D interconnections are designed as mechanically compliant microstructures to mitigate the reliability challenges of inflexible and brittle solder bonds. The continual enlargement and contraction of silicon, pushed by ambient temperature fluctuations and warmth dissipation, typically generate stress and pressure. TriChipLink’s compliant 3D interconnections successfully take in these stresses, guaranteeing reliability.
Powered by DUJUD’s proprietary 3D microfabrication know-how, TriChipLink permits monolithic manufacturing of on-chip and off-chip interconnections, in addition to your complete digital package deal, at speeds far surpassing these of typical strategies corresponding to inkjet 3D printing. Inkjet or aerosol 3D printing undergo from elementary limitations in decision and pace which make them unsuitable for microelectronics. In distinction, TriChipLink achieved decision and pace which are 300% and 20 occasions increased, respectively. “Now we have developed a producing course of for additively constructing 3D digital microdevices. This key functionality has allowed us to invent a solderless meeting and bonding course of that interconnects a number of chips in a 3D SiP with out requiring thermo-compression. For delicate semiconductor units susceptible to thermal drifts throughout thermo-compression bonding, TriChipLink supplies an efficient resolution to stop attribute drifts,” added Dr. Abbaspour.
At the moment, the TriChipLink know-how is out there for SiP functions both by means of direct orders or licensing settlement. For extra info, please contact us at [email protected]
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SOURCE: DUJUD
